Technique for inspecting semiconductor wafers for particulate co

Details Technique for inspecting semiconductor wafers for particulate co Technique for inspecting semiconductor wafers for particulate co

1981-11-05

1984-04-03

Orsino, Jr., Joseph A.

Facsimile and static presentation processing

Facsimile

Specific signal processing circuitry

250574, 356237, H04N 718

Patent

active

044411243

ABSTRACT:
A laser beam (88) is raster scanned over the surface of a patterned semiconductor wafer (66) at an angle normal thereto. A plurality of detectors, radially spaced from the wafer (66) and substantially coplanar therewith detect light scattered from contaminating particulate thereon. The detected light is converted into a video signal that is forwarded to a video monitor (84) to display the particulate material while eliminating the patterned surface background.

REFERENCES:
patent: 3589813 (1971-06-01), Sturzinger
patent: 3624835 (1971-11-01), Wyatt
patent: 3767306 (1973-10-01), Mast et al.
patent: 3807868 (1974-04-01), Simila
patent: 4084902 (1978-04-01), Green
patent: 4197011 (1980-04-01), Hudson
patent: 4208126 (1980-06-01), Cheo et al.
patent: 4286293 (1981-08-01), Jablonski
Grosewald et al.-Automatic Detection of Defects on Wafers-IBM Tech. Bull., vol. 21, #6, Nov. 1978, pp. 2336-2337.
Hopkins-Optical Scanner for Surface Analysis--IBM Tech. Bull., vol. 20, #11B, Apr. 1978-pp. 4939-4940.
Tech. Note-Automatic Inspection of Silicon Wafers-Optics and Laser Technology-Dec. 1980, pp. 317-320.
Scanning Laser Senses Water Defects-Electronics-Mar. 16, 1978, pp. 48, 50.

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