Technique for improving ESD immunity

Electricity: electrical systems and devices – Safety and protection of systems and devices – Transient responsive

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361 58, 361 91, 257356, 257360, H02H 904

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active

052725863

ABSTRACT:
Proper operation of an integrated circuit (IC) is destroyed when voltage exceeding a predetermined level is applied to the circuit. A switching MOS transistor utilizing floating gate technology is used to shunt electrostatic discharge (ESD) away from the IC. The switching MOS transistor is adapted to switch at a voltage level which is greater than the normal operating voltage for the IC but less than the predetermined voltage level characteristic of the IC. A first switching MOS transistor provides a path for a positive ESD stress by having its control gate and drain connected to the line of interest and its source connected to a reference point. Thus, when a positive voltage spike greater than the circuit voltages occurs on the line of interest, the first switching MOS transistor shunts the ESD stress away from the line of interest. A second switching MOS transistor provides a path for a negative ESD stress by having its control gate and drain connected to the reference point and its source connected to the line of interest. Thus, when a negative voltage spike greater than the circuit voltages occurs on the line of interest, the second switching MOS transistor shunts the ESD stress away from the line of interest.

REFERENCES:
patent: 4449158 (1984-05-01), Taira
patent: 4527213 (1985-07-01), Ariizumi
patent: 4630162 (1986-12-01), Bell
patent: 4692834 (1987-09-01), Iwahashi et al.
patent: 4819047 (1989-04-01), Gilfeather et al.
patent: 4890187 (1989-12-01), Tailliet et al.
patent: 4896243 (1990-01-01), Chatterjee et al.
patent: 5111262 (1992-05-01), Chen et al.

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