Technique for enhancing adhesion capability of heat spreaders in

Details Technique for enhancing adhesion capability of heat spreaders in Technique for enhancing adhesion capability of heat spreaders in

1994-07-06

1995-06-06

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 522, 174 524, 257787, 257796, 165 802, 361718, 361722, H05K 720

Patent

active

054227887

ABSTRACT:
Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The substance to be adhered is applied to the coated heat spreader.

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patent: 4542401 (1985-09-01), Sekiba
patent: 4874722 (1989-10-01), Bednarz et al.
patent: 4943844 (1990-07-01), Oscilowski et al.
patent: 5050040 (1991-09-01), Gondusky et al.
patent: 5053357 (1991-10-01), Lin et al.
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patent: 5087962 (1992-02-01), deVos et al.
patent: 5138114 (1992-08-01), Breit et al.
Data Sheet "Comparison of Major Thermal-Spray Coating Process", Advanced Materials and Processes, Feb. 1992, pp. 58-59.
Texas Instruments Incorporated Brochure "Elastic Cavity Package", 1989, Dallas, Tex.
MQUAD Package "A New High Performance Metal Quad Flat Pack" Olin Interconnect Technologies, 1991.

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