Technique for damping electronic module printed wiring board

Details Technique for damping electronic module printed wiring board Technique for damping electronic module printed wiring board

1976-01-22

1977-10-11

Smith, Jr., David

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

188 1B, H02B 162

Patent

active

040539431

ABSTRACT:
A vibration damping system for a printed circuit board in which laminated damping elements are remotely positioned from the printed circuit board.
The laminated damping elements are connected to the printed circuit board by post structural means fastened rigidly at each end to the printed circuit board and to the laminated damping element, respectively, for the purpose of transferring vibration energy from the printed circuit board to the damping element. The laminated damping elements comprise a high hysteresis bonding agent for bonding the laminate and for absorbing the vibration energy. The high hysteresis bonding agent is stressed in a shear mode for greatest energy absorption efficiency.

REFERENCES:
patent: 3102722 (1963-09-01), Hamontre
patent: 3813582 (1974-05-01), Gikow

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