Technique for attaching a stiffener to a flexible substrate

Details Technique for attaching a stiffener to a flexible substrate Technique for attaching a stiffener to a flexible substrate

1998-11-09

1999-11-23

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29840, H05K 302, H05K 310

Patent

active

059877421

ABSTRACT:
The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.

REFERENCES:
patent: 3557983 (1971-01-01), Hayes et al.
patent: 4893403 (1990-01-01), Heflinger et al.
patent: 5249343 (1993-10-01), Grosso et al.
patent: 5600881 (1997-02-01), Wanha
patent: 5663106 (1997-09-01), Karavakis et al.

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