Technique for accommodating electronic components on a...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S830000, C029S840000, C029S846000, C029S847000

Reexamination Certificate

active

07107673

ABSTRACT:
A technique for accommodating electronic components on a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for accommodating electronic components on a multilayer signal routing device. Such a method comprises determining a component space that is required to accommodate a plurality of electronic components on a surface of a multilayer signal routing device, and then forming at least one signal routing channel on at least the surface of the multilayer signal routing device, wherein the at least one signal routing channel has a channel space that is equal to or greater than the component space.

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“Printed Circuit Board Termination Board Termination Network For High Speed Signal”, Research Disclosure, Kenneth Mason Publications, Hampshire, GB, No. 417, Jan. 1999, pp. 163-166, XP-000888521.
International Search Report dated May 10, 2004 for Application No. PCT/US03/37069.

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