Technique and apparatus for testing electrostatic chucks

Details Technique and apparatus for testing electrostatic chucks Technique and apparatus for testing electrostatic chucks

1997-09-08

1999-06-29

Do, Diep N.

Electricity: measuring and testing

Electrostatic field

361234, G01R 2912, H02N 1300

Patent

active

059173270

ABSTRACT:
A testing apparatus including a testing plate can be used to test an electrostatic wafer chuck. A DC potential is supplied so as to produce an electrostatic force. A mechanical force is supplied to the testing plate in order to give an indication of the produced electrostatic force. By examining the DC potential and the produced electrostatic force, an electrostatic wafer chuck can be qualified or rejected before being placed into a wafer processing machine. This reduces the possibility of damage to the wafer or the wafer processing machine.

REFERENCES:
patent: 4897171 (1990-01-01), Ohmi
patent: 5459632 (1995-10-01), Birang et al.
patent: 5491603 (1996-02-01), Birang et al.
patent: 5684669 (1997-11-01), Collins et al.

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