Stock material or miscellaneous articles – All metal or with adjacent metals – Having marginal feature for indexing or weakened portion for...
Patent
1980-04-14
1982-01-26
Hunt, Brooks H.
Stock material or miscellaneous articles
All metal or with adjacent metals
Having marginal feature for indexing or weakened portion for...
428582, 357 68, 357 69, 357 70, 357 71, H01L 2348, H01L 2932
Patent
active
043129269
ABSTRACT:
In an automatic assembly tape for semiconductor device assembly a continuous tape includes a plurality of sequential metal finger patterns. Each pattern includes a plurality of fingers that extend inwardly to form an array that mates with the bonding pads on a semiconductor device chip. The fingers are bonded to the chip pads so that the chip is then associated with the tape and therefore emenable to further assembly on high speed machines on a reel-to-reel tape handling basis. Each finger pattern includes an inner tear strip ring that initially holds the fingers together in a unitary structure. The fingers are joined to the ring via intermediate weakened regions. After the fingers are bonded to the chip pads, the ring is torn away so as to separate at the weakened regions. Prior to bonding, the fingers are held in precise location and in a common plane. This allows close spaced complex finger patterns and avoids bent fingers which can cause bond failure and possibly clogging of the auto assembly machines.
REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3967366 (1976-07-01), Birglechner et al.
patent: 4218701 (1980-08-01), Shirasaka
patent: 4258458 (1981-03-01), Danna
patent: 4259436 (1981-03-01), Tabuchi et al.
Hunt Brooks H.
National Semiconductor Corporation
Sheridan James A.
Woodward Gail W.
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