TCP type semiconductor device capable of preventing crosstalk

Details TCP type semiconductor device capable of preventing crosstalk TCP type semiconductor device capable of preventing crosstalk

1995-10-05

1997-08-19

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257691, 257787, 257668, H01L 23552

Patent

active

056591985

ABSTRACT:
A wiring pattern having a plurality of leads is formed on the under surface of an insulating film. The inner lead portion of each of the leads is bonded to a corresponding one of bump electrodes formed on pads of a semiconductor chip and the outer lead portion thereof is connected to a corresponding lead wire formed on a printed circuit board. The outer lead portion of one of the leads which acts as a ground line is connected to a grounded lead wire which is formed on the printed circuit board. A shield plate is bonded to the under surface of the leads via insulating adhesive agent. The shield plate is electrically connected to the grounded lead wire. The semiconductor chip and the inner lead portions are hermetically sealed by use of potting resin.

REFERENCES:
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4992628 (1991-02-01), Beppu et al.
patent: 5220196 (1993-06-01), Michii et al.
VLSI Packaging Trends--An Update, J.C. Miller, ITAB '90 Proceedings, pp. 7-17 (1990).
Using Advanced Pulsed Hotbar Solder Technology For Reliable Positioning And Mounting Of High Lead Count Flat Packs And Tab Devices, ITAB '90 Preceedings. pp. 230-249 (1990).

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