Target plate for cathode sputtering

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2041921, C23C 1400

Patent

active

046683739

ABSTRACT:
In conventional attachments of target plates for cathode sputtering the danger always existed that they will become plastically deformed at the operating temperature and detach from a cooling support. For secure attachment without fastening means on the front side to be disintegrated, the target plate according to the invention presents on its back a cutout (4) in which there is inserted by means of a mechanical spring union, e.g. by means of a lock ring (8), an auxiliary body (6) of a material of higher strength and higher softening point than the material to be disintegrated, which body has a threaded bore (12) for attachment of the target plate on a support (1).

REFERENCES:
patent: 3595775 (1971-07-01), Grantham et al.
patent: 3838031 (1974-09-01), Snaper
patent: 4448653 (1984-05-01), Wegmann
patent: 4517070 (1985-05-01), Kisner
patent: 4556471 (1985-12-01), Bergman et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Target plate for cathode sputtering does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Target plate for cathode sputtering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Target plate for cathode sputtering will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-702009

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.