Target for reactive sputtering

Details Target for reactive sputtering Target for reactive sputtering

1991-11-07

1993-05-04

Nguyen, Nam X.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419215, 20419226, 420557, 420563, C23C 1434

Patent

active

052078850

ABSTRACT:
Target for reactive sputtering in a vacuum coating apparatus consists of at least one of tin and lead doped with 20 to 200 ppm gallium and 2 to 20 ppm phosphorus.

REFERENCES:
patent: 3907660 (1975-09-01), Gillery
patent: 4099199 (1978-07-01), Wittry
patent: 4149308 (1979-04-01), Smith
patent: 4806220 (1989-02-01), Finley
patent: 4806221 (1989-02-01), Gillery
patent: 4948529 (1990-08-01), Ritchie et al.
patent: 4948677 (1990-08-01), Gillery
patent: 4960645 (1990-10-01), Lingle et al.

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