Target for magnetron-sputtering systems

Details Target for magnetron-sputtering systems Target for magnetron-sputtering systems

1991-02-04

1992-05-12

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

420436, C23C 1434

Patent

active

051124688

ABSTRACT:
Targets for magnetron - sputtering systems with a high utilization of material are obtained from ferromagnetic alloys if the amount of hexagonal structural phase is greater than the cubic phase portion and if the hexagonal prism axis (0001) is aligned preferably vertically to the target surface.

REFERENCES:
patent: 2981620 (1961-04-01), Brown et al.
patent: 4832810 (1989-05-01), Nakamura et al.

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