Target for cathode sputtering

Details Target for cathode sputtering Target for cathode sputtering

1993-10-27

1994-12-13

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20429809, C23C 1434

Patent

active

053726944

ABSTRACT:
Target tiles formed from the material to be sputtered each have a parallelepipedal configuration and are each soldered, welded or cemented fixedly to a target base plate of similar dimensions, each target base plate being slightly smaller in its length (b) and slightly larger in its width (a) than the corresponding target tile, while the two marginal portions of the target base plates that project in each case beyond the lateral edges of the target tiles are fixed to the cathode body (3) by means of clamping cleats.

REFERENCES:
patent: 4200510 (1980-04-01), O'Connell et al.
patent: 4485000 (1984-11-01), Kawaguchi et al.
patent: 4488956 (1984-12-01), Scherer et al.
patent: 4747927 (1988-05-01), Rille et al.
patent: 4966676 (1990-10-01), Fukasawa et al.
patent: 5039913 (1991-08-01), Wegmann et al.
patent: 5066381 (1991-11-01), Ohta et al.
patent: 5071535 (1991-12-01), Hartig et al.

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