Target for cathode sputtering

Details Target for cathode sputtering Target for cathode sputtering

1992-10-28

1994-08-09

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20429809, C23C 1434

Patent

active

053363868

ABSTRACT:
A sputtering target and target assembly includes a target member having a substantially continuously concave top surface and a bottom surface with a central, downwardly directed hub and at least three annular regions of differing radius of curvature. The shape of the target member bottom surface conforms to a backplate to which it is mounted, thereby facilitating accurate mounting of the target member during sputtering. The corresponding shapes of the target member and backplate promote maximum utilization of sputtering material.

REFERENCES:
patent: 3669871 (1972-06-01), Elmgren et al.
patent: 3878085 (1975-04-01), Corbani
patent: 4604180 (1986-08-01), Hirukawa et al.
patent: 4622121 (1986-11-01), Wegmann et al.
patent: 4668373 (1987-05-01), Rille et al.
patent: 4747926 (1988-05-01), Shimizu et al.
patent: 4842703 (1989-06-01), Class et al.
patent: 4855033 (1989-08-01), Hurwitt
patent: 4885075 (1989-12-01), Hillman

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