Target bonding process

Details Target bonding process Target bonding process

1984-06-06

1985-10-01

Lin, Kuang Y.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228708, 228903, B23K 3102

Patent

active

045440913

ABSTRACT:
A process for bonding one or more target parts, such as yttrium oxide target parts, to a copper backing plate to provide improved mechanical support and improved heat transfer. The process is one in which a noble metal, preferably platinum, is applied to the target to provide an oxide free layer to which indium/lead solder joins. The solder step is performed so that contamination by flux or by formation of an oxide is prevented.

REFERENCES:
patent: 2800710 (1957-07-01), Dunn
patent: 3006069 (1961-10-01), Rhoads et al.
patent: 3173201 (1965-03-01), Motson
patent: 3733182 (1973-05-01), Crossland et al.
patent: 3857161 (1974-12-01), Hutchins

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