Target assembly for sputtering magnetic material

Details Target assembly for sputtering magnetic material Target assembly for sputtering magnetic material

1985-05-23

1986-01-14

Metz, Andrew H.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192R, C23C 1400

Patent

active

045644357

ABSTRACT:
An optimized annular sputter target assembly for use in sputtering magnetic material, comprising a thin target piece of magnetic material mounted on a backing structure of nonmagnetic material. Said backing structure provides means for easy mounting and removal of the target assembly and for providing good thermal and electrical contact with the cooling wall of the sputter source. The target piece has a portion extending radially outwardly from said cooling wall thereby providing greater target surface area.

REFERENCES:
patent: 4060470 (1977-11-01), Clarke
patent: 4100055 (1978-07-01), Rainey
patent: 4299678 (1981-11-01), Meckel
patent: 4370217 (1983-01-01), Funaki
patent: 4385979 (1983-05-01), Pierce et al.
patent: 4414086 (1983-11-01), Lamont, Jr.
patent: 4416759 (1983-11-01), Hara et al.
patent: 4436602 (1984-03-01), Hara et al.
patent: 4457825 (1984-07-01), Lamont, Jr.
patent: 4500409 (1985-02-01), Boys
Jrl. of Crystal Growth 45 (1978), 361-364, "High Rate Deposition of Magnetic Films by Sputtering from Two Facing Targets"-, Naoe, Hoshi and Yamanaka.
One page from Varian Specialty Metals Division Sales Brochure (printed 9/78).

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