Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1981-06-10
1983-01-25
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
C23C 1500
Patent
active
043702171
ABSTRACT:
For use in a magnetron-type sputtering device, a target assembly comprises a magnetic target plate and first and second permanent magnet pieces brought into contact with the target plate circumferentially and centrally of the target plate with differently named poles of the respective magnet pieces placed nearer to the target plate. The magnet pieces may be attached to that surface of the target plate which is directed to a hollow space of the sputtering device. Alternatively, the magnet pieces may be attached to inner and outer circumferential surfaces of the target plate, respectively. Preferably, the magnet pieces are covered with a shield cover of a conductor or the material of the target plate. A conductive body is placed in contact with the target plate on the side opposite to the above-mentioned surface to serve as an electrode. The conductive body is preferably made of a soft magnetic material.
REFERENCES:
patent: 4162954 (1979-07-01), Morrison
patent: 4239611 (1980-12-01), Morrison
Chapin, Research Development Jan. 1974 pp. 37-40.
Vosen et al., Thin Film Processes Academic Press, N.Y., N.Y., pp. 134-139.
Anelva Corporation
Demers Arthur P.
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