Target assembly capable of attaining a high step coverage ratio

Details Target assembly capable of attaining a high step coverage ratio Target assembly capable of attaining a high step coverage ratio

1985-01-18

1986-08-05

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1500

Patent

active

046041800

ABSTRACT:
In a target assembly for use in a magnetron-type sputtering device, a target member of a predetermined material comprises first and second targets which has a planar and a sloping surface, respectively. The planar surface has a circular periphery and is parallel to at least one object held by a holder. The sloping surface has an inner periphery concentrically of the circular periphery and an outer periphery which is nearer to the holder than the inner periphery. The first and the second targets may mechanically be united together or separated from each other and are magnetically individually driven by the use of a magnet member, such as an electromagnet and a permanent magnet, to produce a first and a second partial magnetic field in the vicinity of the first and the second targets, respectively. An electric source member is connected to the first and the second targets to produce an electric field intersecting the first and the second partial magnetic fields. The electric source member may be common to the first and the second targets or divided into two portions for the first and the second targets. The first and the second targets may cooperate with a control circuit for controlling at least one of the first and the second partial magnetic fields and the electric field.

REFERENCES:
patent: 4265729 (1981-05-01), Morrison
patent: 4428816 (1984-01-01), Class
patent: 4472259 (1984-09-01), Class

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