Taping package method for small-size electronic parts

Details Taping package method for small-size electronic parts Taping package method for small-size electronic parts

1984-09-21

1986-02-04

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 206329, 206330, 206331, B32B 3116, B65D 7302, B65D 8542

Patent

active

045684162

ABSTRACT:
Small-size electronic parts having leads are packaged with a carrier tape composed of a tape base having tape feed holes and a tape body of electrically conductive or nonconductive formed plastic attached to one side of the tape base. The carrier tape is unreeled from a supply reel, and the leads of the electronic parts are caused to pierce an upper surface and one side or both sides of the tape body. The carrier tape with the electronic parts retained on the tape body is wound around a takeup reel. With the method of the invention, small-side electronic parts with long leads can easily be packaged with a tape, the packaged electronic parts can easily be shipped and stored, and the electronic parts can easily be detached form the carrier tape.

REFERENCES:
patent: 2518450 (1950-08-01), Cowen et al.
patent: 3069751 (1962-12-01), Deakin
patent: 3245193 (1966-04-01), Schmidt
patent: 4049118 (1977-09-01), Honda et al.
patent: 4231901 (1980-11-01), Berbeco

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