Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-08-04
1996-03-05
Engel, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156191, 156447, 156522, B32B 3100
Patent
active
054964300
ABSTRACT:
A taping method and apparatus for performing at least one taping operation. Each taping operation is performed by adhering an extra length of adhering allowance of a tape to an outer surface of a coil having a coil bobbin rotatably supported by a spindle. A tape retaining means is used to retain the tape against a tape rolling means while a foremost end of the tape is projected, by a distance corresponding to the extra length of adhering allowance, ahead of a retaining position defined by the tape retaining means. The distance between the spindle and the tape rolling means is shortened until they come into contact thereby causing the extra length of adhering allowance to adhere to the outer surface of the coil. Thereafter, the tape is wound about the coil by rotating the spindle, and a tape cutting means is displaced to cut the tape while the tape is retained between the tape retaining means and the coil bobbin and such that a subsequent extra length of adhering allowance of the tape does not enter a region defined by the tape retaining means. Any tape remaining on the coil is then wound by rotating the spindle. The coil bobbin is retractively displaced in an upward direction, and the tape is projected ahead of the retaining position of the tape retaining means by a distance corresponding to the extra length of adhering allowance. The above steps are repeated until all taping operations are completed.
REFERENCES:
patent: 2510131 (1950-06-01), Morin
Suekane Yoji
Takeda Kyoji
Engel James
Tanaka Seiki Co., Ltd.
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