Taping apparatus for lead frame

Details Taping apparatus for lead frame Taping apparatus for lead frame

1990-01-22

1991-01-15

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156518, 156530, B32B 3118

Patent

active

049851055

ABSTRACT:
A taping apparatus for adhering taping members to a lead frame, comprising: a die having a punch for cutting a heat-adherent tape to form individual taping members. The taping member is moved and pushed against a surface of a heater block on which a lead frame is rested and heated, so that the taping member is heated and adhered to the lead frame. The tape is intermittently fed along the passage in synchronization with an operation of the die, and before punching slack is provided in the tape.

REFERENCES:
patent: 4279682 (1981-07-01), Hamagami et al.
patent: 4289568 (1981-09-01), Trotsky et al.
patent: 4581096 (1986-04-01), Sato
patent: 4683023 (1987-07-01), Sokolovsky
patent: 4925515 (1990-05-01), Yoshimura et al.

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