Tapered structure for providing coupling between external...

Optical waveguides – With optical coupler – Particular coupling structure

Reexamination Certificate

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C385S030000, C438S031000, C438S040000

Reexamination Certificate

active

06993225

ABSTRACT:
Methods of forming a tapered evanescent coupling region for use with a relatively thin silicon optical waveguide formed with, for example, an SOI structure. A tapered evanescent coupling region is formed in a silicon substrate that is used as a coupling substrate, the coupling substrate thereafter joined to the SOI structure. A gray-scale photolithography process is used to define a tapered region in photoresist, the tapered pattern thereafter transferred into the silicon substrate. A material exhibiting a lower refractive index than the silicon optical waveguide layer (e.g., silicon dioxide) is then used to fill the tapered opening in the substrate. Advantageously, conventional silicon processing steps may be used to form coupling facets in the silicon substrate (i.e., angled surfaces, V-grooves) in an appropriate relation to the tapered evanescent coupling region. The coupling facets may be formed contiguous with the tapered evanescent coupling region, or formed through the opposing side of the silicon substrate.

REFERENCES:
patent: 5513288 (1996-04-01), Mayer
patent: 5515464 (1996-05-01), Sheem
patent: 5910012 (1999-06-01), Takeuchi
patent: 6090636 (2000-07-01), Geusic et al.
patent: 6316281 (2001-11-01), Lee et al.
patent: 6387720 (2002-05-01), Misheloff et al.
patent: 6504977 (2003-01-01), Krishnamoorthy
patent: 6760529 (2004-07-01), Chong et al.
patent: 2002/0068396 (2002-06-01), Fitzgerald
Hiroshi Nishihara, Masamitsu Haruna, Toshiaki Suhara, “Optical Integrated Circuits”, McGraw-Hill Book Company, 1989-printed in the United States of America.
P.K. Tien, R. Ulrich, “Theory of Prism-Film Coupler and Thin-Film Light Guides”, Journal of the Optical Society of America, vol. 60, No. 10, Oct. 1970.
L.A. Coldren, Y.A. Akulova, E.M. Strzelecka, B.J. Thibealt, J.C. Ko, and D.A. Louderback, “Vesel Array Packaging for Free Space Interconnects” Report 1996-1997 for Micro Project 96-050, Materials and Electrical & Computer Engineering Departments, University of California, Santa Barbara CA 93106.

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