Tapered hollow metallic microneedle array assembly and...

Metal working – Method of mechanical manufacture – Assembling or joining

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S017300, C604S272000, C604S290000

Reexamination Certificate

active

07627938

ABSTRACT:
The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.

REFERENCES:
patent: 4578770 (1986-03-01), Mitani
patent: 4596792 (1986-06-01), Vyas
patent: 4599230 (1986-07-01), Milich et al.
patent: 4599231 (1986-07-01), Milich et al.
patent: 4601903 (1986-07-01), Frasch
patent: 4608251 (1986-08-01), Mia
patent: 5591139 (1997-01-01), Lin et al.
patent: 6334856 (2002-01-01), Allen et al.
patent: 6406638 (2002-06-01), Stoeber et al.
patent: 6503231 (2003-01-01), Prausnitz et al.
patent: 6511463 (2003-01-01), Wood et al.
patent: 6551849 (2003-04-01), Kenney
patent: 6565532 (2003-05-01), Yuzhakov et al.
patent: 6692680 (2004-02-01), Lee et al.
patent: 6748954 (2004-06-01), Lee et al.
patent: 2002/0133129 (2002-09-01), Arias et al.
patent: 2002/0155737 (2002-10-01), Roy et al.
patent: 2005/0011858 (2005-01-01), Kuo et al.
patent: 2005/0137531 (2005-06-01), Prausnitz et al.
patent: 2006/0015061 (2006-01-01), Kuo et al.
Kim et al, “A Tapered Hollow Metallic Microneedle Array using Backside Exposure of SU-8”, Journal of Micromechanics and Microengineering, Published Feb. 6, 2004 [all].
Kuo et al., “A Novel Polymer Microneedle Arrays and PDMS Micromolding Technique”, Tamkang Journal of Science and Engineering, vol. 7, No. 2, pp. 95-98 (2004), Published Feb. 2004.
Ahn, C., et al., “Disposable smart lab-on-a-chip for point-of-c may be clinical diagnostics,” Proc. 2004, IEEE, pp. 92154-92173.
Chandrasekaran, S., et al., “Characterization of surface micromachined metallic microneedles,” J.MEMS, 2003, pp. 12288-12295.
Kabseog Kim, et al., “A tapered hollow metallic microneedle array using backside exposure of SU-8,” 2004, Journal of Micromechanics and Microengineering, vol. 14, No. 4, pp. 597-603.
Kabseog Kim, et al., “Rapid replication of polymeric and metallic high aspect ratio microstructures using PDMS and LIGA technology,” 2001, Microsystem Technologies, vol. 9, No. 1-2, pp. 5-10.
Lin, L., et al., “Silicon-processed microneedles,” J.MEMS 1999, pp. 878-884.
McAllister, D. V., et al., “Three-dimensional hollow microneedle and microtube arrays” 10th Int. Conf. Solid-State Sensors and Actuators 1999, pp. 1098-1101.
S. W. Park, et al., “Massive replication of polymeric high aspect ratio microstructures using PDMS casting,” in Proceedings of the SPIE 2001 Smart Electronics and MEMS, Mar. 2001, SPIE vol. 4334, pp. 271-279 Newport Beach, CA.
Zimmermann, S., et al., “A microneedle-based glucose monitor: fabricated on a wafer-level using in-device enzyme immobilization,” 12th Int. Conf. Solid-State Sensors and Actuators, 2003, pp. 99-102.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tapered hollow metallic microneedle array assembly and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tapered hollow metallic microneedle array assembly and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tapered hollow metallic microneedle array assembly and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4057131

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.