Tapered groove IC isolation

Details Tapered groove IC isolation Tapered groove IC isolation

1985-05-13

1987-01-06

Larkins, William D.

Metal treatment

Stock

Ferrous

148DIG51, 148DIG85, 148DIG161, 148DIG168, 357 55, 357 54, 357 60, H01L 2704, H01L 21302

Patent

active

046350900

ABSTRACT:
A semiconductor device and the method of manufacturing the same are disclosed, the semiconductor device having a plurality of elements isolated by a groove having a gentle slope at the upper side wall, and a steep slope at the lower side wall. This groove provides low steps on its mouth and occupies a small area on the substrate, thus enabling an extremely high-density integrated circuit to be formed.

REFERENCES:
patent: 3900350 (1975-08-01), Appels et al.
patent: 3980508 (1976-09-01), Takamiya et al.
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4104090 (1978-08-01), Pogge
patent: 4240095 (1980-12-01), Rosetti
patent: 4309716 (1982-01-01), el-Kareh
Forget et al., IBM Tech. Discl. Bulletin, vol. 22, No. 11, Apr. 1980, p. 4886.

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