Tape substrate and tape made therefrom

Textiles: knitting – Fabrics or articles – Incorporated unknitted materials

Reexamination Certificate

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Details

C066S195000

Reexamination Certificate

active

10927705

ABSTRACT:
The present disclosure relates to a tape that comprises a weft-inserted warp knit fabric, which utilizes a combination stitch to secure the wales of the fabric. The combination stitch comprises a majority of successive chain stitches that are used with a minority of subsequent successive tricot stitches, such that the stitch follows the expression x+y, where x is the number of successive chain stitches and y is the number of subsequent successive tricot stitches. Contemplated x values are in the range of 5 to 15, and contemplated y values are in the range of 1 to 4. Multiple stitch formations can also be used (e.g., following an x+y/m+n/etc. configuration). The resulting weft-inserted warp knit fabric possesses superior dimensional stability and internal geometry, while maintaining the tearability requisite for a hand-tearable tape product.

REFERENCES:
patent: 4015449 (1977-04-01), Matsuda et al.
patent: 4244199 (1981-01-01), Rhode
patent: 4285216 (1981-08-01), Duhl
patent: 4304813 (1981-12-01), Elmore, Jr.
patent: 4388364 (1983-06-01), Sanders
patent: 4444026 (1984-04-01), Matsuda
patent: 4636427 (1987-01-01), Ohno et al.
patent: 4668563 (1987-05-01), Buese et al.
patent: 5014403 (1991-05-01), Buese
patent: 5227225 (1993-07-01), Mamish
patent: 5353486 (1994-10-01), Schmidt et al.
patent: 5461885 (1995-10-01), Yokoyama et al.
patent: 5480708 (1996-01-01), Cheng
patent: 5507079 (1996-04-01), Schmidt et al.
patent: 5641560 (1997-06-01), Schmidt et al.
patent: 5706677 (1998-01-01), Matsuda
patent: 5950457 (1999-09-01), Wagner, Jr. et al.
patent: 6006552 (1999-12-01), Matsuda et al.
patent: 6082148 (2000-07-01), Wakai et al.
patent: 6180545 (2001-01-01), Okeya et al.
patent: 6183861 (2001-02-01), Carroll
patent: 6211099 (2001-04-01), Hutto, Jr. et al.
patent: 6223782 (2001-05-01), Watkins
patent: 6282926 (2001-09-01), Matsuda et al.
patent: 6330892 (2001-12-01), Shimono
patent: 6332341 (2001-12-01), Matsuda
patent: 6446471 (2002-09-01), Kaplancali
patent: 6503855 (2003-01-01), Menzies et al.
patent: 2001/0027821 (2001-10-01), Shimono
patent: 2002/0115369 (2002-08-01), Yokoyama et al.
patent: 2003/0162017 (2003-08-01), Weir et al.
patent: 2004/0237597 (2004-12-01), Oya et al.
patent: AO99/65433 (1999-12-01), None

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