Tape substrate and method for fabricating the same

Details Tape substrate and method for fabricating the same Tape substrate and method for fabricating the same

2007-08-14

2007-08-14

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S041000, C029S846000, C029S849000, C427S098300, C174S250000, C174S262000

Reexamination Certificate

active

11023162

ABSTRACT:
A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the copper foil pattern at the connecting area after the coating of the solder resist; and plating tin on the plated barrier layer plated, thereby forming a tin layer on the barrier layer. Another method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; plating a barrier layer over the formed copper foil pattern; plating tin over the barrier layer after the plating of the barrier layer, thereby forming a tin layer over the barrier layer; and coating a solder resist on the tin layer at a region other than the connecting area, after the formation of the tin layer.

REFERENCES:
patent: 2004/0161626 (2004-08-01), Kwon et al.
patent: 2002289653 (2002-10-01), None

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