Spring devices – Bendable along flat surface – Flexural support
Reexamination Certificate
2008-04-08
2008-04-08
Schwartz, Chris (Department: 3683)
Spring devices
Bendable along flat surface
Flexural support
C267S151000, C052S653200
Reexamination Certificate
active
11461547
ABSTRACT:
A tape-spring shaped, articulating member used in deployable structures having a resilient, compliant hinge region and rigid non-hinge regions, thereby enabling a smaller fold radius and greater packaging efficiency. The increased compliance in the hinge region may be obtained by using a more compliant material in the hinge region or reducing the cross-sectional area in the hinge region. The hinge region may be reinforced with integrated shape memory alloy features serving as folding mandrels, to enhance structural stiffness and strength performance of the hinge, and to exhibit authority over the rate and sequencing of strain release when deployed.
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patent: 7160627 (2007-01-01), Pyzik et al.
patent: 2005/0022465 (2005-02-01), Warren et al.
Fred L. Beavers, et. Al, “Design and testing of an Elastic Memory Composite Deployment hinge spacecraft,” 43rdStructures, Structural Dynamics, and Materials Conf., Apr. 22-25, 2002, AIAA-2002-1452 (pp. 2-4).
Pollard, EL & Murphey, TW, “Novel, Concentrated Stain Deployable Architectures Utilizing Shape Memory Alloy Flexures,”NIA Large Space Systems Workshop, Santa Fe, NM, US, 2005. (Aug. 16, 2005) (pp. 3, 7).
Jason D. Hinkle, Lee D. Peterson, Peter A. Warren, “Structural Performance of an Elastically Stowable Tubular Truss Column” Presented at the 43rd Structures, Structural Dynamics and Materials Conference, Apr. 22-25, 2002 Denver, Colorado AIAA 2002-1555. (Shows an example of another deployable truss based on tape-springs).
Mark S. Lake, et al, “Application of elastic memory composite materials to deployable space structures,” AIAA Space 2001 Conf., Aug. 28-30, 2001, AIAA 2001-4602. (p. 7).
Murphey Thomas W
Pollard Eric L
Callahan Kenneth E.
Schwartz Chris
The United States of America as represented by the Secretary of
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