Tape splicing apparatus and attaching apparatus

Details Tape splicing apparatus and attaching apparatus Tape splicing apparatus and attaching apparatus

2006-11-15

2011-11-22

Tucker, Philip (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

Reexamination Certificate

active

08062450

ABSTRACT:
Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes (210) each having an ACF (212), and includes: a first holding unit that holds one of the ACF tapes (210); a second holding unit that holds the other one of the ACF tapes (210); a positioning unit (115) that positions the ACF tapes (210) to be overlapped in a thickness direction; and a pressing unit (116) that presses the overlapped ACF tapes (210) in the thickness direction.

REFERENCES:
patent: 5810966 (1998-09-01), Semba
patent: 2004/0069112 (2004-04-01), Onoshiro et al.
patent: 48-34459 (1973-10-01), None
patent: 48-34460 (1973-10-01), None
patent: 6-16346 (1994-03-01), None
patent: 6-064796 (1994-03-01), None
patent: 7-7024 (1995-01-01), None
patent: 7-297230 (1995-11-01), None
patent: 8-157113 (1996-06-01), None
patent: 2000-289900 (2000-10-01), None
patent: 2003-197677 (2003-07-01), None
patent: 2004-200126 (2004-07-01), None
patent: 2004-202738 (2004-07-01), None
Machine translation of JP H06-16346 U.
International Search Report issued Dec. 19, 2006 in the International (PCT) Application of which the present application is the U.S. National Stage.

Affiliated with

Also associated with

Rating

Tape splicing apparatus and attaching apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape splicing apparatus and attaching apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape splicing apparatus and attaching apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4276125