Tape packages

Details Tape packages Tape packages

1984-03-08

1986-08-19

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 81, 357 69, 361406, H01R 900, H01L 2340, H01L 2348

Patent

active

046072764

ABSTRACT:
The present invention is directed to Tape Packages adapted to house semiconductor devices. The packages comprise a base component having a cover component disposed thereon to form an enclosure to house the semiconductor. A tape lead frame is disposed between the base and the cover and has a plurality of lead fingers extending into the enclosure for electrical connection to the semiconductor component. A spring between the base and the semiconductor device presses the semiconductor device into contact with the cover component. The spring comprises at least one of the lead fingers which is bonded to the semiconductor device and formed into an arch-like shape which contacts the base component.

REFERENCES:
patent: 3553828 (1971-01-01), Starger
patent: 3676292 (1972-07-01), Pryor et al.
patent: 3781596 (1973-12-01), Galli et al.
patent: 3838443 (1974-09-01), Laighton
patent: 4092664 (1978-05-01), Davis, Jr.
patent: 4117508 (1978-09-01), Koenig
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4180828 (1979-12-01), Schermer et al.
patent: 4188636 (1980-02-01), Sato et al.
patent: 4312926 (1982-01-01), Burns
patent: 4330790 (1982-05-01), Burns
patent: 4415025 (1983-11-01), Horvath
patent: 4466183 (1984-08-01), Burns
patent: 4484381 (1984-11-01), Ellis et al.
J. Gow, III, Semiconductor Device Package, IBM Technical Disclosure Bulletin, vol. 5, No. 12, p. 10, (5/1963).
E. E. Zirnis, Semiconductor Module with Improved Air Cooling, IBM Technical Disclosure Bulletin, vol. 20, No. 5, p. 1768 (10/1977).
"Chip-Carriers, Pin Grid Arrays Change the PC-Board Landscape" by Jerry Lyman, Electronics, Dec. 29, 1981, pp. 65-75.

Affiliated with

Also associated with

Rating

Tape packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape packages will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-396459