Tape-packaged headed pin contact

Details Tape-packaged headed pin contact Tape-packaged headed pin contact

2005-11-22

2005-11-22

Mohandesi, Jila M. (Department: 3728)

Special receptacle or package

For a fastener

Flaccidly or integrally connected

C206S341000, C206S820000

Reexamination Certificate

active

06966440

ABSTRACT:
A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.

REFERENCES:
patent: 5046610 (1991-09-01), Runyon et al.
patent: 5101975 (1992-04-01), Runyon et al.
patent: 5499717 (1996-03-01), Hayashi
patent: 5648136 (1997-07-01), Bird
patent: 5690233 (1997-11-01), Kaneko
patent: 5747139 (1998-05-01), Schenz
patent: 5765692 (1998-06-01), Schenz
patent: 5931298 (1999-08-01), Huang
patent: 6003676 (1999-12-01), Beyer
patent: 6116835 (2000-09-01), Blacket et al.

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