Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1980-03-24
1982-05-18
Husar, Francis S.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
29588, 29827, 29856, 174 52PE, 357 72, H01L 2900, H01R 4302
Patent
active
043307906
ABSTRACT:
A semiconductor device is bonded to a contact finger pattern which is located in a continuous tape. A metal package cup is fabricated from metal stock so as to have a flat rim portion around its periphery. A plastic insulating sheet is punched so that it forms an overlapping cover for the flat rim and is attached thereto. The tape mounted semiconductor device is then bonded to the inside of the cup and the metal fingers bonded to the insulating sheet covering the flat rim. Provision is made for one of the fingers to connect to the cup. Then the device is encapsulated using one of two techniques. In the first a cap that mates with the cup is provided with a bonded insulating film cover and is bonded to the cup with its overlying metal fingers, so that a metal housing results. An encapsulating material is then injected inside the housing by way of a hole in the cap. Alternatively the semiconductor device can be covered by a suitable casting material. The active device leads can then be severed from the tape and formed into their ultimate form so that the device can be tested in tape form prior to being excised from the tape.
REFERENCES:
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3628483 (1971-12-01), Pauza
patent: 3767839 (1973-10-01), Beal
patent: 3859718 (1975-01-01), Noe
patent: 4000842 (1977-01-01), Burns
patent: 4079511 (1978-03-01), Grabbe
Arbes Carl J.
Husar Francis S.
National Semiconductor Corporation
Schulte Neil B.
Sheridan James A.
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