Tape of connections for assembly-line mounting of surface-mounte

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

357 70, 361306, H05K 502

Patent

active

050601172

ABSTRACT:
The disclosure concerns a metallic tape that has been previously cut out and is designed for the mounting of surface-mounted components (SMC), using chips having two metallizations on two opposite faces. Each component position, demarcated by two transversal slots, comprises two external connections, each extended by a contact element. This contact element is characterized by a curved shape, formed by a surface to be soldered and a tongue so that, after folding, to create a space for the component, the surfaces to be soldered overlap partially, forming a clip for the component. The disclosure is applicable to the fabrication of SMC components.

REFERENCES:
patent: 4003125 (1977-01-01), Wallick
patent: 4129682 (1978-12-01), Stewart et al.
patent: 4400714 (1983-08-01), Brown
patent: 4497012 (1985-01-01), Gottlieb et al.
patent: 4539623 (1985-09-01), Irikura et al.
patent: 4571662 (1986-02-01), Conquest et al.
patent: 4600971 (1986-07-01), Rose et al.
patent: 4809054 (1989-02-01), Waldner

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