Tape joint compounds with CMC thickener system

Compositions: coating or plastic – Coating or plastic compositions – Carbohydrate or derivative containing

Reexamination Certificate

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C106S780000, C106S801000, C106S805000, C106S140100, C106S162810, C106S162820, C106S173010, C106S190100, C524S045000

Reexamination Certificate



CMC with CMDS greater than or equal to 0.76, optionally with a non-ionic co-thickener or a CMC with CMDS less than 0.75 is used as both the rheology modifier and partial clay substitute in tape joint compounds. This significant reduction of clay level is sufficient to eliminate most of the negative characteristics of clay in joint compound.

patent: 3891582 (1975-06-01), Desmarais
patent: RE29753 (1978-09-01), Williams
patent: 5336318 (1994-08-01), Attard et al.
patent: 5382287 (1995-01-01), Podlas
patent: 5512616 (1996-04-01), Podlas
patent: 6712897 (2004-03-01), Ayambem et al.
patent: 2004/0158058 (2004-08-01), Cash et al.


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