Tape joint compounds with CMC thickener system

Details Tape joint compounds with CMC thickener system Tape joint compounds with CMC thickener system

2006-09-19

2006-09-19

Brunsman, David (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Carbohydrate or derivative containing

C106S780000, C106S801000, C106S805000, C106S140100, C106S162810, C106S162820, C106S173010, C106S190100, C524S045000

Reexamination Certificate

active

07108744

ABSTRACT:
CMC with CMDS greater than or equal to 0.76, optionally with a non-ionic co-thickener or a CMC with CMDS less than 0.75 is used as both the rheology modifier and partial clay substitute in tape joint compounds. This significant reduction of clay level is sufficient to eliminate most of the negative characteristics of clay in joint compound.

REFERENCES:
patent: 3891582 (1975-06-01), Desmarais
patent: RE29753 (1978-09-01), Williams
patent: 5336318 (1994-08-01), Attard et al.
patent: 5382287 (1995-01-01), Podlas
patent: 5512616 (1996-04-01), Podlas
patent: 6712897 (2004-03-01), Ayambem et al.
patent: 2004/0158058 (2004-08-01), Cash et al.

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