Tape for forming resin tie bar, resin tie bar, lead frame...

Details Tape for forming resin tie bar, resin tie bar, lead frame... Tape for forming resin tie bar, resin tie bar, lead frame...

2005-02-15

2005-02-15

Zirker, Daniel (Department: 1771)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550AC, C428S346000, C428S349000, C428S473500, C428S480000, C257S729000, C257S730000, C257S783000, C257S692000

Reexamination Certificate

active

06855418

ABSTRACT:
A resin tie bar1A is formed from a base material10, 11of a heat-resistant resin whose melting point is higher than the temperature during resin molding and an insulative adhesive layer12on the base material10, 11and formed from an insulative adhesive agent that may or may not be removable prior to resin molding depending upon its composition. The resin tie bar1A is applied to the surface of the leads22of a lead frame, and resin molding is then performed, during which the resin tie bar1A is pressed by a heated mold3,which softens the insulative adhesive agent of the resin tie bar1A and pushes it into the gaps23between the leads22of the lead frame. Thus the resin tie bar1A can be easily formed into a shape that is favorable for the leads22of the lead frame.

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