Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1995-04-06
1996-07-23
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
346 24, 83176, 83658, 83694, 83858, B32B 3500
Patent
active
055385915
ABSTRACT:
A tape cutting apparatus is described for cutting off a portion of tape (4) comprising first and second layers (4a,4c) secured one to another by an adhesive layer (4b). The apparatus comprises an anvil (40) and a cutter support member (31) carrying a blade (30), the cutter support member and the anvil being mounted for relative movement to bring the blade into contact with a facing surface of the anvil. The facing surface has a stepped portion (40) over which the tape is bent during cutting such that when the tape is released the first and second layers tend to separate from one another at the cut edge.
REFERENCES:
patent: 1742295 (1930-01-01), Young
patent: 2185885 (1940-01-01), Bruker et al.
patent: 2372020 (1945-03-01), Sandberg
patent: 3423984 (1969-01-01), Keymer
patent: 3435717 (1969-04-01), Macomber
patent: 3530028 (1970-09-01), Messmer
patent: 3533616 (1970-10-01), Bettenhausen
patent: 3755049 (1973-08-01), Leloux
patent: 3902954 (1975-09-01), Lotto
patent: 4173507 (1979-11-01), Tobey
patent: 4685991 (1987-08-01), Herrmann et al.
patent: 5066152 (1991-11-01), Kuzuya et al.
patent: 5259681 (1993-11-01), Kitazawa et al.
Collins Ian
Cooper Alan R.
Day Robert C. L.
Heyse Geert
Opgenhaffen Erik
Esselte Dymo N.V.
Osele Mark A.
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