Tape core wire wiring apparatus

Details Tape core wire wiring apparatus Tape core wire wiring apparatus

2006-06-09

2010-10-12

Kim, Paul D (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S605000, C029S606000, C029S754000, C029S791000, C029S854000, C257S531000, C336S200000, C336S223000, C336S232000, C336S233000

Reexamination Certificate

active

07810229

ABSTRACT:
There is provided a tape core wire manufacturing apparatus that makes it possible to manufacture a large variety of tape core wires in small quantities with ease, and in addition, makes it easy to apply a uniform coating over a broad width. In the tape core wire manufacturing apparatus of the present invention, a coating apparatus that applies a coating material to respective optical fiber core wires has a coating head that moves in the longitudinal direction relatively to the respective optical fiber core wires that have been placed in a row on a coating jig. The coating head has a position adjustment surface that is located in the vicinity of a coating member of the coating head and adjusts the positioning in the thickness direction of the respective optical fiber core wires when these are in the form of a tape. This position adjustment surface is pressed against the respective optical fiber core wires. The coating head is also able to be tilted in the longitudinal direction.

REFERENCES:
patent: 4291732 (1981-09-01), Artzer
patent: 59-226304 (1984-12-01), None
patent: S60-72451 (1985-05-01), None
patent: 63-187208 (1988-08-01), None
patent: 05-119243 (1993-05-01), None
patent: 06-123826 (1994-05-01), None
patent: 07-503095 (1995-03-01), None
patent: H08-054522 (1996-02-01), None
patent: 2001160412 (2001-06-01), None
patent: 2003-241041 (2003-08-01), None
patent: 2004-163634 (2004-06-01), None
patent: 2004-240152 (2004-08-01), None
patent: 93/14505 (1993-07-01), None
Japanese Patent Office, Japanese Office Action in corresponding JP Application No. 2005-172605, issued on Oct. 28, 2008, 5 pages.
Japanese Patent Office, Japanese Office Action in corresponding JP Application Serial No. 2005-172606, issued Nov. 18, 2008, 3 pages.
Japanese Patent Office, Japanese Office Action in corresponding JP Patent Application No. 2005-172605 issued on Nov. 24, 2009, 4 pages.
Japanese Patent Office, Japanese Office Action in corresponding JP Application No. 2005-172605, issued Jul. 13, 2010, 3 pages.

Affiliated with

Also associated with

Rating

Tape core wire wiring apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape core wire wiring apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape core wire wiring apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4154246