Tape cast silicon carbide dummy wafer

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Casting of film

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Details

264670, 264682, 264166, C04B35/565

Patent

active

059048921

ABSTRACT:
This invention relates to tape casting a silicon carbide slip to eventually produce a silicon carbide wafer having a thickness of between 0.5 and 1 mm and a diameter of at least 150 mm, the wafer preferably having a strength of at least 30 MPa, and a porosity wherein at least 85% of the pores are no larger than 12 microns.

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D. Hotza, P. Greil, "Review: aqueous tape casting of ceramic powders", 1995, Materials Science and Engineering A202, pp. 206-217.
A. Kristoffersson, E. Carlstrom, "Solid-State-Sintered Silicon Carbide by Water-Based Tape Casting", Fourth Euro Ceramics, vol. 1, pp. 367-374, Italy.
J.A. Lewis, K.A. Blackman, A.L. Ogden, J.A. Payne, L.F. Francis, "Rheological Property and Stress Development during Drying of Tape-Cast Ceramic Layers", Journal of the American Ceramic Society, vol. 79, No. 12, Dec. 1996, pp. 3225-3234.
R. Moreno, "The Role of Slip Additives in Tape Casting Technology: Part II--Binders and Plasticizers", American Ceramic Society Bulletin, vol. 71, No. 11, Nov. 1992, pp. 1647-1657.
Daniel J. Shanefield, "Organic Additives and Ceramic Processing, Second Edition: With Applications in Powder Metallurgy, Ink, and Paint", Cover page and p. 288, Hingham, MA.
G.P. van der Beek, U. Gontermann-Gehl, E. Krafczyk, "Binder Distribution in Green Ceramic Foils", Journal of the European Ceramic Society, vol. 15, 1995, pp. 741-758.

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