Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Reexamination Certificate
2008-07-01
2008-07-01
Jackson, Jerome (Department: 2815)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having substrate registration feature
C438S015000, C257S048000, C257S668000, C257S797000, C257SE23179
Reexamination Certificate
active
10870941
ABSTRACT:
A tape carrier type semiconductor device comprising: a long flexible insulating tape; and a plurality of semiconductor devices sequentially arranged on one surface of the tape, wherein each semiconductor device has a wiring pattern and a semiconductor element, and wherein each semiconductor device has either a hole or a target mark inside a predetermined region enclosed by an outline of the semiconductor device, the outline being for die-cutting into pieces, the hole being bored through the tape for indicating that the semiconductor device is a non-defective, the target mark not being bored through the tape for indicating that the semiconductor device is a defective.
REFERENCES:
patent: 5729315 (1998-03-01), Takahashi et al.
patent: 5841188 (1998-11-01), Murasawa
patent: 6523446 (2003-02-01), Tanabe et al.
patent: 6788091 (2004-09-01), Weber
patent: 6953989 (2005-10-01), Kiriyama
patent: SHO 630288038 (1988-11-01), None
patent: 02-271545 (1990-11-01), None
patent: 03104249 (1991-05-01), None
patent: 03104252 (1991-05-01), None
patent: 05021536 (1993-01-01), None
Inomo Keiichi
Iwane Tomohiko
Díaz José R.
Jackson Jerome
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
LandOfFree
Tape carrier type semiconductor device and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Tape carrier type semiconductor device and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape carrier type semiconductor device and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3941907