Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Reexamination Certificate
2008-07-01
2008-07-01
Jackson, Jerome (Department: 2815)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having substrate registration feature
C438S015000, C257S048000, C257S668000, C257S797000, C257SE23179
Reexamination Certificate
active
07393754
ABSTRACT:
A tape carrier type semiconductor device comprising: a long flexible insulating tape; and a plurality of semiconductor devices sequentially arranged on one surface of the tape, wherein each semiconductor device has a wiring pattern and a semiconductor element, and wherein each semiconductor device has either a hole or a target mark inside a predetermined region enclosed by an outline of the semiconductor device, the outline being for die-cutting into pieces, the hole being bored through the tape for indicating that the semiconductor device is a non-defective, the target mark not being bored through the tape for indicating that the semiconductor device is a defective.
REFERENCES:
patent: 5729315 (1998-03-01), Takahashi et al.
patent: 5841188 (1998-11-01), Murasawa
patent: 6523446 (2003-02-01), Tanabe et al.
patent: 6788091 (2004-09-01), Weber
patent: 6953989 (2005-10-01), Kiriyama
patent: SHO 630288038 (1988-11-01), None
patent: 02-271545 (1990-11-01), None
patent: 03104249 (1991-05-01), None
patent: 03104252 (1991-05-01), None
patent: 05021536 (1993-01-01), None
Inomo Keiichi
Iwane Tomohiko
Díaz José R.
Jackson Jerome
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
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