Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-06-28
2005-06-28
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S773000, C174S255000
Reexamination Certificate
active
06911729
ABSTRACT:
In a COF manufactured by bonding and mounting a semiconductor element onto a wiring pattern on a lengthy tape carrier, the wiring patterns are aligned in more than one direction with respect to a direction in which the tape carrier is fed. The wiring patterns have a layout that increases a utilized area of the tape carrier (in other words, such that reduces useless areas). Consequently, the number of the tape carrier semiconductor devices manufactured out of a tape carrier of a certain length can be increased thereby saving manufacturing costs.
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Chambliss Alonzo
Nixon & Vanderhye PC
Sharp Kabushiki Kaisha
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