Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-10-08
2000-04-18
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
060508302
ABSTRACT:
A tape carrier package having many pins with a fine pitch can be simultaneously attained through a simplified positioning during the connection to external devices. Leads (4) and (5) are formed from an over coat area (3), which is formed at the central area of a base film (2), which is made of a resin, such as polymide, for example. Furthermore, outer leads (4a) at the input side and outer leads (5a) at the output side are respectively formed in a manner so that they extend towards both edge areas of the base film (2). A notched section 6 is formed between the outer leads (5a) at the output side of the base film (2), and through this, each of the regions (2a) and (2b) expands independently during a thermocompression bonding. The notched section 6 is provided almost at the central area of the base film (2) in the longitudinal direction, and outer leads (5) at the output side in the same number (256 for example) are formed at both of its sides in a pitch of approximately 70 .mu.m. A reinforcing device (13) is provided across the notch.
REFERENCES:
patent: 4636019 (1987-01-01), Gillett
patent: 5598627 (1997-02-01), Saka et al.
patent: 5610642 (1997-03-01), Nobel et al.
Abrams Neil
Donaldson Richard L.
Kempler William B.
Patel T C
Texas Instruments Incorporated
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