Tape carrier package and method of fabricating the same

Details Tape carrier package and method of fabricating the same Tape carrier package and method of fabricating the same

2006-06-27

2006-06-27

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C174S250000, C349S150000, C361S749000, C361S760000, C438S106000, C438S975000, C439S067000

Reexamination Certificate

active

07067334

ABSTRACT:
A tape carrier package with a widow that is capable of confirming an alignment extent between the tape carrier package and a print wiring board in bonding the tape carrier package mounted with an integrated circuit on the liquid crystal panel and the print wiring board. In the package, the integrated circuit is mounted onto a base film. Input pads are connected to the integrated circuit and formed on the base film. Dummy pads are formed at the left and right side thereof not to be connected to the integrated circuit. Windows are provided by opening the base film adjacent to the dummy pads to expose at least two of said dummy pads.

REFERENCES:
patent: 5221858 (1993-06-01), Higgins, III
patent: 5404239 (1995-04-01), Hirai
patent: 5448387 (1995-09-01), Kurokawa et al.
patent: 5546279 (1996-08-01), Aota et al.
patent: 6018196 (2000-01-01), Noddin
patent: 6084291 (2000-07-01), Fujimori
patent: 6104619 (2000-08-01), Shigehiro
patent: 6127196 (2000-10-01), Butera et al.
patent: 6319019 (2001-11-01), Kwon et al.
patent: 3-225934 (1991-10-01), None

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