Tape carrier package and its fabrication method therefor

Details Tape carrier package and its fabrication method therefor Tape carrier package and its fabrication method therefor

1998-12-15

2000-08-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361751, 361760, 361762, 257668, 257690, 257734, 257735, 349150, H05K 702

Patent

active

061046191

ABSTRACT:
A tape carrier package (TCP) and method of fabricating a tape carrier package (TCP) are provided to reduce a width dimension in a slim tape carrier package (TCP) used in a flat-panel display apparatus, such as a liquid crystal display (LCD) apparatus. While some margin in width is necessary for absorbing the spreading of potting resin that seals a driver integrated circuit (IC), the spreading is limited within a narrow area by providing a configuration that is formed of an insulating film on a flexible insulating board. An insulating-film-omission region for not arranging an insulating film is installed within a band of the insulating film for covering a group of wirings on the insulated film board and is arranged to surround the mounting region of the driver integrated circuit (IC). The insulating-film-omission region serves for storing the sealing resin, while an inner edge of the band of the insulating film serves as a levee for preventing the sealing resin from wetting and spreading.

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