Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-10-30
2008-12-02
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07458819
ABSTRACT:
A tap tape of a tape carrier package prevents connection parts from being eroded. The tap tape includes a base film having a device hole formed to mount a driver chip for driving a panel of a flat panel display, input patterns positioned on the base film and having a plurality of electrode pads connected to a side of the device hole, output patterns positioned on the base film and having a plurality of electrode pads connected to the other side of the device hole; and connection parts positioned at the ends of the input patterns or the output patterns and having electrode pads of widths different from widths of the electrode pads.
REFERENCES:
patent: 6982694 (2006-01-01), Matsuzaki
patent: 6995814 (2006-02-01), Kanatsu
patent: 7012667 (2006-03-01), Pai
patent: 7033185 (2006-04-01), Kuo
patent: 7234945 (2007-06-01), Azuma et al.
patent: 7241148 (2007-07-01), Chao et al.
patent: 7281929 (2007-10-01), Yoo
Fish & Richardson P.C.
LG Electronics Inc.
Nguyen Khiem
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