Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2000-04-04
2002-06-18
Enad, Elvin (Department: 2832)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S668000, C257S779000, C361S749000, C361S760000
Reexamination Certificate
active
06407447
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a tape carrier package, to which semiconductor pellets are bonded and which is used for such as a flexible printed circuit (FPC), in particular, in which a tape automated bonding (TAB) tape is used.
DESCRIPTION OF THE RELATED ART
First, a first example of a conventional tape carrier package is explained.
FIG. 1
is a plan view of the first example of the conventional tape carrier package.
FIG. 2
is a sectional view at the C to C′ section of FIG.
1
. As shown in
FIGS. 1 and 2
, a conventional tape carrier package
50
provides plural conductive leads
53
on a base film
52
having a device hole
51
whose shape is rectangular. And inner leads
53
a
of the conductive leads
53
are formed in a state that the inner leads
53
a
stick out to the device hole
51
. Furthermore, sprocket holes
54
are provided at the both edges side of the base film
52
in a state that the sprocket holes
54
have the same intervals.
A semiconductor pellet (die)
55
provides plural metal bumps
56
, and each of the plural metal bumps
56
is bonded to a corresponding inner lead
53
a
of the conductive leads
53
by a heat press of a pressing tool (not shown).
Next, a second example of the conventional tape carrier package is explained.
FIG. 3
is a sectional view of the second example of the conventional tape carrier package. In this, at the second example, equivalent elements to the first example shown in
FIGS. 1 and 2
have the same reference numbers, and the same explanation is omitted. As shown in
FIG. 3
, a conventional tape carrier package
60
provides a base film
61
not having a device hole, and plural conductive leads
62
are provided on this base film
61
. And a semiconductor pellet
55
provides plural metal bumps
56
, and each of the plural metal bumps
56
is bonded to a corresponding inner lead
62
a
of the conductive leads
62
by a heat press of a pressing tool (not shown).
This second example is a tape carrier package used so called a face down bonding system. At this tape carrier package, the inner leads
62
a
are fixed to the base film
61
, therefore this package has a characteristic that the inner leads
62
a
are not bent easily by external force. This example is disclosed in Japanese Patent Application Laid-Open No. HEI 5-251510.
Next, a third example of the conventional tape carrier package is explained. This third type example is disclosed in Japanese Patent Application Laid-Open No. HEI 3-85740 and Japanese Patent Application Laid-Open No. HEI 3-101140.
FIG. 4
is a plan view of the third example of the conventional tape carrier package.
FIG. 5
is a sectional view at the D to D′ section of FIG.
4
. In this, at the third example, equivalent elements to the first example shown in
FIGS. 1 and 2
have the same reference numbers, and the same explanation omitted. As shown in
FIGS. 4 and 5
, a conventional tape carrier package
70
provides plural conductive leads
72
on a base film
52
having a device hole
71
whose shape is rectangular. And inner lead
72
a
of the conductive leads
72
are formed in a state that the inner leads
72
a
do not stick out to the device hole
71
. Furthermore, sprocket holes
54
are provided at the both edge sides of the base film
52
in a state that the sprocket holes
54
have the same intervals.
And a semiconductor pellet
55
provides plural metal bumps
56
, and each of the plural metal bumps
56
is bonded to a corresponding inner lead
72
a
of the conductive leads
72
by a heat press of a pressing tool (not shown).
And at least one or more slits
73
are provided at the base film
52
between adjacent conductive leads
72
at the near parts of the tip of the inner leads
72
a
of the conductive leads
72
. By providing this kind of slits
73
, a stress generated by the differences of thermal expansion coefficients and humidity expansion coefficients among a sealing resin material (not shown) using at bonding, the conductive leads
72
, the base film
52
, and the semiconductor pellet
55
can be absorbed. With these slits, defects caused by cracking of the resin material and braking of leads can be prevented.
However, at the tape carrier package
50
of the first example, the inner leads
53
a
float in the air, as a result, there is a problem that the inner leads
53
a
are easily bent by external force. In order to solve this problem, the tape carrier package
60
of the second example was developed. However, at this tape carrier package
60
, the alignment between the semiconductor pellet
55
and the inner leads
62
a
is technically difficult, consequently, there is a problem that the yield is reduced. As the same as the second example, in order to solve the problem of the tape carrier package
50
of the first example, the tape carrier package
70
of the third example was also developed. However, at this tape carrier package
70
, the base film
52
is deformed by the temperature at the bonding, as a result, there is a problem that non-intentional positions between the semiconductor pellet
55
and the conductive leads
72
may become short-circuit accidentally.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a tape carrier package, in which inner leads are prevented from bending by external force, and the yield is made to improve, and non-intentional short-circuits between wiring on a base film and a semiconductor pellet caused by heat at bonding can be prevented.
According to the present invention, for achieving the objects mentioned above, there is provided a tape carrier package. Said tape carrier package provides a base film in which rectangular shaped first holes are provided, plural conductive leads, whose one ends are positioned not sticking out to each of said rectangular shaped first holes, on said base film, a second holes provided at the corner parts of each of said rectangular shaped first holes on said base film at the outside of each of said rectangular shaped first hole, and a semiconductor pellet in which plural metal bumps are provided. And said plural metal bumps are bonded to corresponding ends of said plural conductive leads.
According to the present invention, said conductive leads are provided on said base film in a state that said one ends of said conductive leads do not stick out to each of said rectangular shaped first holes, and said second holes are provided at the corner parts of each of said rectangular shaped first holes at the outside of each of said rectangular shaped first holes. With this structure, inner leads of said conductive leads are prevented from bending by external force, the yield is made to improve, and short-circuits at non-intentional positions between wiring on said base film and said semiconductor pellet caused by heat at bonding can be prevented.
REFERENCES:
patent: 5220486 (1993-06-01), Takubo et al.
patent: 5554885 (1996-09-01), Yamasaki et al.
patent: 5744859 (1998-04-01), Ouchida.
patent: 5753969 (1998-05-01), Suzuya et al.
patent: 5757068 (1998-05-01), Kata et al.
patent: 5932927 (1999-08-01), Koisumi et al.
patent: 3-85740 (1991-04-01), None
patent: 3-101140 (1991-04-01), None
patent: 4-162734 (1992-06-01), None
patent: 5-251510 (1993-09-01), None
patent: 5-275498 (1993-10-01), None
patent: 9-213737 (1999-08-01), None
Enad Elvin
Lee Kyung S.
Young & Thompson
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