Tape carrier package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Patent

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Details

257668, 257787, H05K 506

Patent

active

06124547&

ABSTRACT:
The invention provides a tape carrier package. An integrated circuit element has a free edge that is not provided with electrodes. A flexible film defines a device hole that is smaller than the integrated circuit element and in which the electrodes of the integrated circuit element are disposed. A plurality of leads are provided on the flexible film and connected to the electrodes through the device hole. At least one flow control member is disposed between the integrated circuit element and the flexible film. The flow control member controls a flow of a resin along the free edge of the integrated circuit element.

REFERENCES:
patent: 5744859 (1998-04-01), Ouchida
JP 63-095639 A (Mitsubishi Electric Corporation) Patent Abstracts of Japan, vol. 12, No. 330 (E-655), Sep. 7, 1998 (Abstract).

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