Tape carrier package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

257674, 257675, 361723, 361690, 361704, H05K 100

Patent

active

053900790

ABSTRACT:
A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.

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Auletta, "Plastic-Dual-In-Line Film Module", IBM Tech Dis. Bulletin, vol. 17, No. 7, Dec. 1974, p. 1893.
Gero Zschimmer, "Impulsloten-die Alternative fur SMDs", Elektronik, vol. 25, pp. 57-64, Dec. 12, 1986.
IBM Corp., "Flexible Film Interlead Support", IBM Technical Disclosure Bulletin, vol. 32 No. 8A; 332-333 (1990).
IBM Corp., "Laser Microwelding of Tape Automatel Bonding Components For Surface-mounted Technologies", vol. 31, No. 6, pp. 385-389 (1988).
IBM Corp., "Hybrid Thermode For Solder Attach", vol. 33, No. 2; 175-176 (1990).

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