Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-09-09
1995-02-14
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257674, 257675, 361723, 361690, 361704, H05K 100
Patent
active
053900790
ABSTRACT:
A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.
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Aomori Kokichi
Honda Michiharu
Okabe Toshihiro
Hitachi , Ltd.
Thompson Gregory D.
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