Tape carrier including leads on both sides and resin-encapsulate

Details Tape carrier including leads on both sides and resin-encapsulate Tape carrier including leads on both sides and resin-encapsulate

1993-10-14

1995-02-21

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257666, 257668, H01L 2328, H01L 2348, H01L 2946, H01L 2962

Patent

active

053919238

ABSTRACT:
A tape carrier includes an electrically insulating carrier tape having a first tape surface to which a heat-dissipating metal cap is attached and a second tape surface opposite the first tape surface, a plurality of leads disposed on each of the tape surfaces and a surface area on the second tape surface free of leads for mounting a resin injection runner of a mold die directly on the tape. The present invention also includes a semiconductor device using the tape carrier and a method for manufacturing the semiconductor device.

REFERENCES:
patent: 2054609 (1936-09-01), Barrett
patent: 4648481 (1987-03-01), Lee
patent: 5064706 (1991-11-01), Ueda et al.
patent: 5196917 (1993-03-01), Ueda et al.

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