Tape carrier for TAB

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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C174S1170FF, C174S1170FF, C174S255000, C428S192000

Reexamination Certificate

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10680112

ABSTRACT:
Electric conductor patterns having inner leads arranged at a pitch of not larger than 60 μm are formed on a front surface of an insulating layer of a tape carrier for TAB. A reinforcing layer of stainless steel foil is formed on a rear surface of the insulating layer so as to be extend along a lengthwise direction at opposite side edge portions in a widthwise direction of the insulating layer. Accordingly, both dimensional accuracy and positional accuracy can be improved at the time of carrying the tape carrier for TAB or at the time of mounting and bonding electronic parts though the insulating layer can be formed so as to be thin.

REFERENCES:
patent: 5001888 (1991-03-01), Groth
patent: 5345039 (1994-09-01), Yamazaki
patent: 5507903 (1996-04-01), Yamamori et al.
patent: 5975178 (1999-11-01), Otsuka et al.
patent: 6192579 (2001-02-01), Hayashi et al.
patent: 6313526 (2001-11-01), Nakamura
patent: 6320135 (2001-11-01), Saito
patent: 6633002 (2003-10-01), Atou
patent: 6740966 (2004-05-01), Nakamura
patent: 6919513 (2005-07-01), Chung et al.
patent: 5-29394 (1993-02-01), None
patent: 5-82591 (1993-02-01), None
patent: 10-144735 (1998-05-01), None
patent: 2000-332062 (2000-11-01), None
patent: 2000-340617 (2000-12-01), None

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