Tape carrier for increasing the number of terminals between the

Details Tape carrier for increasing the number of terminals between the Tape carrier for increasing the number of terminals between the

1995-03-14

1998-03-24

Tran, Minh-Loan

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257737, 257778, H01L 2348

Patent

active

057316309

ABSTRACT:
A tape carrier for increasing the number of terminals between the tape carrier and a substrate includes a film, a lead, a terminal and a connection. The film has first and second surfaces and includes first and second regions. The first region of the film is covered with a device when the device is received by the first surface of the film. The film has an opening between the first and second regions. The lead is provided on the first surface of the film and extends above the opening of the film. The lead is coupled to the device at the opening of the film when the device is received by the first surface of the film. The terminal is provided on the second surface in the first region of the film. The connection connects the lead to the terminal. The lead and the device are connected together by thermocompression bonding with a thermode inserted into the opening of the film.

REFERENCES:
patent: 5350947 (1994-09-01), Takekawa et al.
patent: 5352926 (1994-10-01), Andrews
patent: 5367435 (1994-11-01), Andros et al.
"Thin Film Module"; IBM Technical Disclosure Bulletin, Jan. 1989, pp. 135-138.
R. Tummala et al.; "Microelectronics Packaging Handbook", pp. 409-424.
"All of the printed wiring board 91' (Purinto Haisenban no Subete 91')"; Nikkan Kogyo Shinbunsha, Tokyo 1991, pp. 170-171.

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